Nano board is a new type of thermal insulation material manufactured with the latest high-tech technology, and its thermal conductivity is smaller than that of still air. Under high temperature conditions, the heat insulation performance is 3 to 4 times better than traditional fiber insulation materials. Nano board has a significant energy saving effect. It has the characteristics of light weight, high temperature resistance, simple processing and fast construction.material. The nano board has ultra-low thermal conductivity, can greatly save energy compared with the traditional heat insulation
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Category:
Insulation Thermal Material
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154872569@qq.com
Nano Board Details
Nano board is a new type of thermal insulation material manufactured with the latest high-tech technology, and its thermal conductivity is smaller than that of still air. Under high temperature conditions, the heat insulation performance is 3 to 4 times better than traditional fiber insulation materials. Nano board has a significant energy saving effect. It has the characteristics of light weight, high temperature resistance, simple processing and fast construction.material.
The nano board has ultra-low thermal conductivity, can greatly save energy compared with the traditional heat insulation material.
This product has been widely used in aerospace, military industry, machinery, ceramic chemical metallurgy, electrical appliances and other complex thermal engineering equipment, which has solved many worldwide problems. The product packaging has glass fiber cloth, aluminum foil and waterproof plastic film, which can be bent for construction.
It can replace traditional thermal insulation materials, opening up a new way of thermal insulation technology.
(1) Prevent thermal movement of gas molecules
According to the theory of molecular thermal motion, the heat transfer of gas is mainly through the collision of higher-speed molecules on the high-temperature side to lower-speed molecules on the low-temperature side, and the heat is transported step by step. If a series of barriers are established in the direction of the temperature gradient and the barrier distance is less than the average free path of the gas molecules, and the barriers are closed and close to the pores in the vacuum state, it will effectively prevent the thermal movement of the gas molecules.
(2) Reduce heat conduction
The thermal conductivity of nanoporous silicon micropowder is 0.016~0.024W/m.k, which is the super thermal insulation material with the lowest thermal conductivity. For aluminum foil with a thickness of only 6 to 10 μm, the thermal conductivity is 0.038 to 0.042 W/m.k, which is a very good thermal insulation material.
(3) Insulation radiation
The composite reflective insulation panel is composed of nano-SiO2 and aluminum foil. The multi-layer aluminum foil plays the role of reflecting heat radiation with a reflectivity of more than 87%, and at the same time plays the role of isolating heat conduction, heat convection and heat radiation.
Features
1.High temperature resistance, long-term use temperature is 400 ~ 1000 degrees.
2.Thermal conductivity is lower than conventional thermal insulation materials.
3.Durability, can be used as a permanent insulation layer with a service life of more than 5 to 10 years
Safe and environmental protection, good thermal stability, will not release any harmful substances.
4.Low price, more energy saving than traditional materials.
Application
Furnace and furnace door, furnace cover, ladle, torpedo tank, tundish in metallurgy, petrochemical, building materials, power and machinery industries;
Fire insulation for automobile engine heat shields, catalytic exhaust pipes and other industrial and electronic data recorders, fuel cells and other components.
Physical And Chemical Indicators
Brand Property |
TP950 |
TP1000 |
TP1100 |
|
Melting Point (℃) |
≥1200 |
≥1200 |
≥1200 |
|
Operating Temperature (℃) |
950 |
1000 |
1100 |
|
Density (kg/m³) |
280-350 |
550-650 |
550-650 |
|
Compressive strength (MPa) |
0.5 |
0.8-1.2 |
0.8-1.2 |
|
800℃ Heating wire shrink 800℃ (%) |
≤1.9 |
≤1.9 |
≤1.9 |
|
Thermal Conductivity (w/m.k)
|
200℃ |
0.016 |
/ |
/ |
400℃ |
0.021 |
0.043 |
0.047 |
|
600℃ |
0.026 |
0.057 |
0.058 |
|
800℃ |
0.035 |
0.063 |
0.069 |
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